Thermal Imaging Components

UEW Series Thermal Imaging Core Module

EATECH

Thermal ImagingThermal Imaging Components

Overview: Wafer-Level Packaged (WLP) Thermal Imaging Core Module The UEW Series is a compact, low-power uncooled thermal imaging module developed on wafer-level packaging technology. It is ideal for integration into d...

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Specifications & Details

Overview: Wafer-Level Packaged (WLP) Thermal Imaging Core Module

The UEW Series is a compact, low-power uncooled thermal imaging module developed on wafer-level packaging technology. It is ideal for integration into drones, handheld security devices, and consumer thermal scopes.

Key Features

High Performance Optical System: Optimized for challenging outdoor and tactical environments with stable thermal detection performance.
High Performance Optical System: Optimized for challenging outdoor and tactical environments with stable thermal detection performance.
High Performance Optical System: Optimized for challenging outdoor and tactical environments with stable thermal detection performance.

Technical Specifications

Model	UE612W	UE312W	UE317W	UE212W
Sensor Material	Vox
Array Format	640×512	384×288	384×288	256×192
Pixel Pitch	12μm	12μm	17μm	12μm
Spectral Range	8-14μm
Typical NETD NETD	<40mK
Digital Output	Built-in 14-bit ADC
Thermal Time Constant	<12ms
Maximum Frame Rate	50Hz
Power Consumption	＜150mW	＜140mW	<180mW	<75mW
Dimensions (mm)	17.3×17.3×3.9	17.3×17.3×2.6	18×16×2.75	10.53×7.44×1.45
Weight	<2g	<2g	<2g	<0.5g
Operating Temperature	-40°C ~ +85°C