Thermal Imaging Components

UEC Series Thermal Imaging Core Module

EATECH

Thermal ImagingThermal Imaging Components

Overview: Ultra-Compact Thermal Imaging Core Module for OEM Integration The UEC Series OEM core module provides high-quality infrared image processing, low latency, and flexible digital interfaces (MIPI/DVP/USB), enab...

Request a Quote Ask for Samples

Lead timeSamples 1–2 weeks

MOQ1 pc (samples)

SupportFAE included

Specifications come from the product description in Shopify admin — paste the spec-table HTML from the theme's assets/product-descriptions.html file.

Specifications & Details

Overview: Ultra-Compact Thermal Imaging Core Module for OEM Integration

The UEC Series OEM core module provides high-quality infrared image processing, low latency, and flexible digital interfaces (MIPI/DVP/USB), enabling rapid integration into third-party optoelectronic systems.

Key Features

High Performance Optical System: Optimized for challenging outdoor and tactical environments with stable thermal detection performance.
High Performance Optical System: Optimized for challenging outdoor and tactical environments with stable thermal detection performance.
High Performance Optical System: Optimized for challenging outdoor and tactical environments with stable thermal detection performance.

Technical Specifications

Model	UE1212C	UE612C	UE312C	UE317C
Sensor Material	Vox
Array Format	1280×1024	640×512	384×288
Pixel Pitch	12μm			17μm
Spectral Range	8-14μm
Typical NETD NETD	＜50mK	＜35mK	＜35mK	＜30mK
Digital Output	Built-in 14-bit ADC
Thermal Time Constant	＜12ms
Maximum Frame Rate	50Hz
Power Consumption	＜400mW	＜150mW	＜140mW	＜180mW
Dimensions (mm)	31×31×5.1	18.5×18.5×3.8	18.5×18.5×3.8	18.5×18.5×3.8
Weight	＜15g	<4.5g	<4.5g	＜4.5g
Operating Temperature	-40°C ～ +85°C